All other services
Destructive Testing
Microsections
A microsection is a quality control technique where a small specific sample of the PCB is cut, mounted in epoxy, polished and examined under a microscope.
This process allows detailed inspection of internal features such as via and through-hole plating, copper thickness, layer alignment, and—critically—solder joints and interconnections. Microsection analysis can reveal defects including solder voids, insufficient hole fill, cracks, delamination, and plating irregularities that are not detectable through visual inspection or automated optical inspection (AOI).
Microsections are an effective method for identifying internal defects that cannot be observed externally and provides valuable insight into assembly quality. It is also widely used to verify product conformity and to validate specific manufacturing processes, materials, and design requirements.
Peel & Pull Tests
A peel test is a fundamental mechanical test used to evaluate the strength and performance of an adhesive bond. The test involves applying a tensile force to a flexible substrate bonded with an adhesive to either another flexible material—such as tape, thin film, or rubber—or a rigid substrate, including metal, rigid plastic, or composite materials. Typical results from peel testing include initial peak force, average peel force across the bond, and peel strength, calculated as the average force per unit width of the specimen.
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Peel testing is essential for assessing the seal strength and overall reliability of adhesive bonds. A thorough understanding of bond performance in real-world applications is critical when manufacturing adhesives and bonded components. Environmental factors and specimen conditioning play a significant role, as prolonged exposure to varying temperatures can impact adhesive bond strength over time.
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This type of testing is particularly valued by our defence customers, as their assemblies must perform reliably in extreme environments. Peel testing provides an effective method for verifying product conformity and validating specific manufacturing processes and design requirements.
Solderability Tests
Advanced Assembly Solutions offers solder float and solder dip testing to evaluate PCB solderability. These tests verify that surface finishes will produce reliable, robust solder joints during assembly and assess resistance to thermal stress.
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Solderability testing is a simple and effective way to confirm PCB readiness prior to assembly—particularly for boards that have been stored for extended periods. It can also help identify potential issues related to storage conditions or surface degradation.
Beading on pinflex
Encapsulation of a connector on a pinflex board
Encapsulation of a connector on a flex PCB
Beading on pinflex
Conformal Coats, Encapsulation & Beading
Conformal Coating
Conformal coat is a thin transparent layer of film (typically between 25-75 microns thick) which is applied to the finished PCBA by brushing, spraying or dipping. Conformal coats are an excellent low cost solution to protect your board from: mositure, humidity, dust, light, mild chemical exposure and corrosion. Conformal coats are transparent and light weight allowing rework to still be possible if ever needed.
Beading
Beading is in which a sealant is applied in specific areas using a pneumatic pressure and time-controlled machine to ensure a precise application. This is a low cost way to protect local moisture ingress, vibration at stress points and to seal connectors. Beading will not cover heat sensitive areas or servicable areas allowing rework to still be possible.
Encapsulation
The process of encapsulation is to fully embed the PCB or specific components in a soild compound. This provides the maximum enviromental and mechanical protection possible while giving excellent electrical insulation. It it also a great way to protect from moisture, strong vibrations and shock, chemicals and tampering. Due to the encapsulation rework is not possible which is why it is popular amongst the defence industry, it is impossible to reverse engineer.
AS9102 FAIRs
We have experienced and trained operators in AS9102 rev C to conduct FAIRs to your specified drawing.
Storage
Certain components may require a large MOQ (minimum order quantity) or you may want to buy in bulk to bring the unit cost down. We have space to store your components until you are ready to use them. We have the facility to reseal moisture sensitive devices.
Wiring
Advanced Assembly Solutions has the capability to cut, strip, tin, crimp and solder wires to connectors and PCBs. We can also encapsulate wiring solder connections.
